SmartEEs Matchmaking: Logistics & Packaging

7 May 2021 @ 09:00 13:00 CEST

Logistics and packaging are an integral part of the global economy, something we’ve all realized even more so as during the Corona Crisis. Adding flexible and wearable technologies to the mix presents myriad possibilities for reimagining age-old issues

Packages need to be tracked, but so do items in warehousesPrinted electronics and flexible sensors offer new opportunities for discreet and cheaper tracking and inventory solutions. Printed inks can be integrated into packaging for perishable goods, handy for the consumer but also valuable for producers, wholesalers, and distributors.

Entire supply chains depend on efficient and effective logistics and packaging, and the possibilities for integration of flexible and wearable electronics are, quite literally, endless.

About the SmartEEs Matchmaking Fridays:
Three Regional Clusters. Multiple Online Sessions. One Goal.

Developing Business Opportunities in Flexible and Wearable Electronics.

SmartEEs cluster partners DSP Valley (BE/NL), Minalogic (FR) and OES (DE) are proud to announce a series of online sessions bringing SMEs, Midcaps, Labs and RTOs together around Flexible Electronics Business Opportunities.

  • Cooperation and networking are essential to get the tech just right, and to bring viable products to (new) markets.
  • In online sessions, we invite you to meet with potential partners through
    • visionary keynotes
    • pitching sessions and
    • curated matchmaking

New angles, fresh ideas, existing technology.

All free-of-charge.

Free Registration required

DSP Valley, Minalogic, OES

SmartEEs Matchmaking Fridays: Automotive Edition

19 March 2021 @ 09:00 11:00 CET

Together with our partners Minalogic and OES, we are proud to announce a series of online sessions bringing SMEs, Midcaps, Labs and RTOs together around Flexible & Wearable Electronics (FWE) Business Opportunities.

  • Flexible& Wearable Electronics have enormous potential, from healthcare to automotive to textiles, and the business possibilities are endless.
  • Cooperation and networking are essential to get the tech just right, and to bring viable products to (new) markets.
  • In three sessions spread across January and March 2021, we invite you to
    • meet with potential partners through
      • visionary key notes
      • pitching sessions (possibilities as well as challenges)
      • curated matchmaking

New angles, fresh ideas, existing technology.

Members: Apply to pitch your tech or your application!

We’re currently offering spots to pitch to DSP Valley members only. If you think you have a can’t-miss pitch, feel free to get in touch via email: jane.judge[at]dspvalley.com

Automotive Edition

The combination of flexible electronics and automotive has a bright future, with OLED lighting illuminating the path to come.

Whether it is sensors, OLED displays and lighting, heaters or other applications, there are plenty of opportunities for flexible electronics to be integrated into automotive applications. Some of these technologies have already been on the market for a few years, e.g. OLED lighting appearing in rear taillights, while recent developments in flexible and printed electronics can supply new, exciting functionalities. The current trends of sustainable transportation and self-driving vehicles open a lot more opportunities for flexible electronics to be utilized. Market analysts predicted the market size for flexible electronics in automotive will exceed $5.5 billion by 2026.

Whether we’re discussing integrating flexible electronics into automotive parts, or matching flexible electronic technology to digital applications in the automotive sector, there are many ways the two sectors offer each other fruitful collaboration.

Free

DSP Valley, Minalogic, OES

Online

Wherever you are! + Google Map

SmartEEs Matchmaking Fridays: Textiles Edition

5 March 2021 @ 09:00 13:00 CET

Together with our partners Minalogic and OES, we are proud to announce a series of online sessions bringing SMEs, Midcaps, Labs and RTOs together around Flexible & Wearable Electronics (FWE) Business Opportunities.

  • Flexible& Wearable Electronics have enormous potential, from healthcare to automotive to textiles, and the business possibilities are endless.
  • Cooperation and networking are essential to get the tech just right, and to bring viable products to (new) markets.
  • In three sessions spread across January and March 2021, we invite you to
    • meet with potential partners through
      • visionary key notes
      • pitching sessions (possibilities as well as challenges)
      • curated matchmaking

New angles, fresh ideas, existing technology.

Members: Apply to pitch your tech or your application!

We’re currently offering spots to pitch to DSP Valley members only. If you think you have a can’t-miss pitch, feel free to get in touch via email: jane.judge[at]dspvalley.com

Textiles Edition

Flexible & Wearable Electronics (FWE) in textiles offers all kinds of possibilities in fields such as medical, sport, artistic, aerospace, military, manufacturing, construction and much more.

Possibilities offered by converging textile and electronic can push limits by extending the functionality and usefulness of common fabrics. The development of smart materials allows for a wide spectrum of functions, for instance: flexibility, ergonomics, low power consumption, integration and eventually autonomy.

FWE can integrate a high level of intelligence in textiles, especially regarding interaction with the environment and users, thereby opening an endless window of opportunities.

Free

DSP Valley, Minalogic, OES

Online

Wherever you are! + Google Map

Idea2Industry Conference

7 October 2020 All day

How do inventors make the difficult step from a proof of concept or a first physical prototype to a minimal viable product? Learn more at From Idea to Industry. Bits&Chips is organizing the first edition of the conference in Eindhoven on 7 October 2020.  DSP Valley is a partner of this event.

250€ – 400€ Special discount for DSP Valley members

Please contact Programme Manager Guus Dhaeze to ask about your member discount!

Bits & Chips

+31 24 350 3532

View Organizer Website

Igluu

Lichttoren 32
Eindhoven, 5611 BJ Netherlands
+ Google Map

Machine Learning Conference

23 September 2020 All day

DSP Valley is once again partnering with Bits & Chips of the second edition of the Machine Learning Conference. On 23 September 2020, the Verkadefabriek in ‘s-Hertogenbosch will be the place to gain knowledge on machine learning, deep learning and artificial intelligence. The conference program focuses on the application of Machine Learning techniques in the high tech industry. Hear from fellow DSP Valley members Edgise, UGent, & Verhaert, plus many other great speakers.

325€ DSP Valley members can register at a discount

If you are a DSP Valley member and would like to attend at a discount, please contact our Programme Manager Guus Dhaeze.

Bits & Chips

+31 24 350 3532

View Organizer Website

Verkadefabriek

Boschdijkstraat 45
‘s-Hertogenbosch, 5211 VD Netherlands
+ Google Map
View Venue Website

Industrial 5G Conference – Call for Papers Open

THIS EVENT HAS BEEN POSTPONED DUE TO COVID-19 – THE CALL FOR PAPERS IS STILL OPEN

This conference will be the place to gain knowledge about 5G in high-tech systems, factory automation, industrial automation, robotics, production and wireless communication. The reach of 5G will have no bounds, affecting every company regardless of its size or the industry type. This symposium will offer a broad view on the challenges and opportunities ahead. Bits&Chips, together with DSP Valley, will present the first edition of the Industrial 5G Conference this year.

250€ – 400€

Bits & Chips

+31 24 350 3532

View Organizer Website

Igluu

Lichttoren 32
Eindhoven, 5611 BJ Netherlands
+ Google Map

SmartEEs Webinar

E-learning webinar flat landing page on blue background with human characters, clouds and bubbles vector illustration

29 May 2020 @ 13:00 13:30 UTC

The SmartEEs Project is funded by Horizon 2020 and is aimed at supporting SMEs and Mid-caps in integrating flexible and wearable electronics into novel (series of) products.

In this webinar, DSP Valley CEO Dieter Therssen will explain all about the project and what the benefits are for companies thinking about applying.

Free

DSP Valley

+32(0)162441440

View Organizer Website

Online

Wherever you are! + Google Map

Smart Sensors 4 Agri-Food Kicks Off

On February 21, the members of the Thematic Smart Specialization Partnership Smart Sensors 4 Agri-Food met at CTIC in the Gijón Technology Park in Spain. The main topic on the agenda was agreement on the partnership’s governance structure and its working plan for the near future. Additionally, the members elected the partnership’s chairs.

Connecting competences, facilitating digital transformation

18 clusters and research partners from 14 European regions set themselves the twin goals of boosting the digital transformation of the agri-food sector and facilitating access to applicable solutions for industry. By connecting competences across Europe, the partners as well as their members and stakeholders will gain a better understanding of agri-food´s opportunities, challenges, and requirements with relation to digital technologies.

The partnership has identified four core challenges that it will address initially:

  • Match the needs of agri-food companies with the solutions and capabilities of the technology and digital solution providers, building a “trust zone” between the involved sectors.
  • Roll out a step-by-step approach to digital transformation by creating cross-border innovation communities and providing funding opportunities.
  • Develop and demonstrate the integration of digital technologies in production lines with specific requirements for robust solutions.
  • Adopt and establish vocational and professional training programs for companies and their employees.

Two European projects up and running

The meeting was held adjacent to a program of study visits and matchmaking events, organized within the two European projects originating from the partnership: “Smart Sensor Systems for Food Safety, Quality Control and Resource Efficiency in the Food Processing Industry‘ (S3FOOD) and “Connecting smart sensor systems for the food industry‘ (Connsensys). S3FOOD provides support to SMEs and a dedicated funding scheme for developing and implementing technologies and digital solutions in the food processing industry. Connsensys focuses on the role and potential of living labs in the innovation ecosystem for the sector’s digital transformation. As such, the Connsensys project is paving the way for a network of living labs that will form a cornerstone in the SS4AF strategy.

“It will be a long way, but based on the established relations to our companies and the focus on applicable solutions, we will generate real added-value for our companies and regions with our partnership,” stated Simon Maas, AgriFood Capital BV (The Netherlands) after he was elected to be the first chair of Smart Sensors 4 Agri-food. Cécile Guyon from Bretagne Dévelopement Innovation (France), and newly-elected vice-chair added, “Connecting competences across European regions is an important key to successfully support SMEs and to facilitate their digital transformation processes. This is why I am happy to be part of this unique partnership.” DSP Valley’s own Bjorn van de Vondel is the newly-chosen chair of the Technology Intelligence working group. Flanders’ FOOD (Belgium) will host the Brussels-based head office of the partnership.

Stay connected

If you want to stay updated about SS4AF, send an e-mail to Veerle Rijkaert (Flanders Food) to receive all the latest news on the partnership and its projects.

Deltaray Launches Disruptive Tech

Less than a year ago, Deltaray officially came on the scene as a new company. They’re already turning heads and disrupting conversations with their unique technology: 3D Xray equipment for 100% inspection of mission-critical mechanical parts.

Quality control woes

Industry needs quality control. It ensures customers receive defect-free products that meet their needs. This we all know. We also know that the current system isn’t perfect. Incomplete or incorrect inspections put users at risk and lead to recalls, which are, of course, are a nightmare for companies. The damage to the company’s reputation, the hassle, the expense.

Inspecting products thoroughly reduces the chances of recalls and also ensures that a company’s products function as they should every time, all the time. Current inspection technology, using CT scanning, cannot yet scan thoroughly and fast enough to do more than random sample checks. Employees can only visually check a product, and often can only do so for a few seconds before needing to move on to the next specimen.

A scanned image demonstrating how Deltaray’s technology works

A unique solution

This is where Deltaray comes in. In cooperation with the University of Antwerp, they’ve developed accelerated 3D x-ray technology that can inspect every individual unit both inside and out, comparing each component to engineering files using AI.

How do they do it? Image-based 3D x-ray scanning enables real time inspection in-line or near-line. at 50 to 100 µm resolution. Form-fit inspections use the CAD file as quality master, making use of AI-enabled inspection to perform fully automated defect detection. The data-driven analysis and resulting reporting is Quality 4.0 compliant.

The exciting technology behind Deltaray’s turnkey inspection solutions offers plenty of possibilities for critical part manufacturers in the automotive, additive manufacturing, critical assemblies, and medical devices industries.

Find out more

Deltaray’s official launch takes place in two weeks. You can meet them and find out more for yourself at the free entry Virtual Industry Fair on June 10. They’ll be one of the keynote speakers at the event.

Interested companies can attend a private open house on 16 and 17 June, where they’ll get a glimpse of the first demo system and be able to interact with the Deltaray team. You can visit their website to get your personal invitation.